PART |
Description |
Maker |
CIM03U241 CIM31U601NE CIM10J301NC CIM21J601NE CIM2 |
Chip Bead ; CIB/CIM Series For EMI Suppression Chip Bead CIB/CIM Series For EMI Suppression
|
Samsung semiconductor
|
BK1608LL241-T |
Multilayer Chip Bead Inductors (BK series)
|
Taiyo Yuden (U.S.A.), I...
|
BK2125LM252-T |
Multilayer Chip Bead Inductors (BK series)
|
Taiyo Yuden (U.S.A.), Inc
|
BK0402HM181-T |
Multilayer Chip Bead Inductors (BK series)
|
Taiyo Yuden (U.S.A.), I...
|
BK2125LM182-T |
Multilayer Chip Bead Inductors (BK series)
|
Taiyo Yuden (U.S.A.), I...
|
BK2125LM152-T |
Multilayer Chip Bead Inductors (BK series)
|
Taiyo Yuden (U.S.A.), I...
|
BK0603HS220-T |
Multilayer Chip Bead Inductors (BK series)
|
Taiyo Yuden (U.S.A.), I...
|
BK0603TM800-T |
Multilayer Chip Bead Inductors (BK series)
|
Taiyo Yuden (U.S.A.), I...
|
BK0603TM121-T |
Multilayer Chip Bead Inductors (BK series)
|
Taiyo Yuden (U.S.A.), I...
|
BK1608LL331-T |
Multilayer Chip Bead Inductors (BK series)
|
Taiyo Yuden (U.S.A.), I...
|